Feasibility Study of 45-nm-Node Scaled-Down Cu Interconnects With Molecular-Pore-Stacking (MPS) SiOCH Films-Reference-Cited by-同舟云学术

Feasibility Study of 45-nm-Node Scaled-Down Cu Interconnects With Molecular-Pore-Stacking (MPS) SiOCH Films

Published:2007-04 Issue:4 Volume:54 Page:797-806
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Tada Munehiro,Ohtake Hiroto,Ito Fuminori,Narihiro Mitsuru,Taiji Toshiji,Kasama Yoshiko,Takeuchi Tsuneo,Arai Kouichi,Furutake N.,Oda Noriaki,Sekine Makoto,Hayashi Yoshihiro

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/4142866/04142906.pdf?arnumber=4142906

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