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Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array

  • Published:2017-07 Issue:7 Volume:27 Page:618-620
  • ISSN:1531-1309
  • Container-title:IEEE Microwave and Wireless Components Letters
  • language:
  • Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Liu Xiaoxian,Zhu ZhangmingORCID,Yang Yintang,Ding Ruixue,Li Yuejin

Funder

National Natural Science Foundation of China

Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory

Shaanxi S & T co-ordinate innovation project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

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