Author:
Griffith Zach,Urteaga Miguel,Rowell Petra,Pierson Richard
Funder
Teledyne Scientific Company IR&D,
Defense Advanced Research Projects Agency (DARPA) and the US Army Research Office (ARO) under the HiFIVE program, contract
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics
Cited by
18 articles.
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2. Design of 340-GHz On-Chip Power Combiners for InP HBT PAs;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
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5. A 2-stage, 140-GHz Class-B Power Amplifier Achieving 22.5% PAE at 17.3 dBm in a 250-nm InP HBT Technology;2022 IEEE/MTT-S International Microwave Symposium - IMS 2022;2022-06-19