A Cost-Effective Flip-Chip Interconnection for Applications from DC until 200 GHz-Reference-Cited by-同舟云学术

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A Cost-Effective Flip-Chip Interconnection for Applications from DC until 200 GHz

Published:2019-11 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE)
language:
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Author:

Testa Paolo Valerio,Morath Helmuth,Goran Panic,Carta Corrado,Ellinger Frank

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9018305/9020710/09021003.pdf?arnumber=9021003

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Analysis of 3D Heterogeneous Integration for Microwave HEMTs;2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE);2023-11-10

2. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29

3. Study on the shear strength evolution of the Au studs bonding under different thermal aging and temperature cycling times;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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