An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging-Reference-Cited by-同舟云学术

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An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging

Published:2012-10 Issue: Volume: Page:
ISSN:
Container-title:2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Tsai Hsing-Hua,Lee Jun-Der,Tsai Chih-Hsin,Wang Hsi-Ching,Chang Che-Cheng,Chuang Tung-Han

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6409557/6420212/06420241.pdf?arnumber=6420241

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research Progress on Bonding Wire for Microelectronic Packaging;Micromachines;2023-02-11

2. Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment;Materials;2023-01-25

3. The electrothermal fracture mechanism between aluminum and copper wires;Microelectronics Reliability;2022-12

4. Die attachment, wire bonding, and encapsulation process in LED packaging: A review;Sensors and Actuators A: Physical;2021-10

5. Effect of electrification and chlorination on the microstructure and electrical properties of fine Al wires;Microelectronics Reliability;2021-09

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