High-aspect-ratio Sub-2-μm Vias Using Thermal Imprint with Build-up Resin-Reference-Cited by-同舟云学术

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High-aspect-ratio Sub-2-μm Vias Using Thermal Imprint with Build-up Resin

Published:2018-10 Issue: Volume: Page:
ISSN:
Container-title:2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Kamibayashi Takumi,Kuwae Hiroyuki,Kishioka Takahiro,Usui Yuki,Ohashi Takuya,Tamura Mamoru,Shoji Shuichi,Mizuno Jun

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8614716/8625712/08625825.pdf?arnumber=8625825

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-temperature copper–copper quasi-direct bonding with cobalt passivation layer;AIP Advances;2022-11-01

2. Low Temperature Copper-Copper Quasi-Di rect Bonding Utilizing Ultra-Thin Metal Interlayer Formation by Atomic Layer Deposition;Journal of Smart Processing;2020

3. Low-Temperature Quasi-Direct Copper–Copper Bonding with a Thin Platinum Intermediate Layer Prepared by Atomic Layer Deposition;Transactions of The Japan Institute of Electronics Packaging;2020

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