Author:
Rencz M.,Szekely V.,Pahi A.,Poppe A.
Cited by
9 articles.
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1. Fast Mutual-Heating Prediction Method for Integrated Electronics and Photonics;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19
2. Fast 3D thermal simulation of power module packaging;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2012-01-18
3. Electrical and Thermal Cosimulation of GaAs Interconnects;IEEE Transactions on Advanced Packaging;2007-11
4. Compact modeling of electrical devices for electrothermal analysis;IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications;2003-04
5. Thermal modelling of semiconductor packages;Microelectronics Journal;2001-10