1. Full-chip reliability analysis;Overhauser;Microelectronics Reliability,1998
2. H. Pape, G. Noebauer, Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods, Proceedings of the Fifteenth SEMI-THERM Symposium, 1999, pp. 201–212.
3. M. Rencz, V. Szekely, A. Pahi, A. Poppe, An alternative method for electro-thermal circuit simulation, Proceedings of SSMSD'99, Tucson, Arizona, USA, April 1999, pp. 117–122.
4. T. Franke, Thermal modelling of multichip assemblies. Proceedings of Therminic'99 Workshop, Rome, October 1999, pp. 107–110.
5. Thermal resistance: an oxymoron?;Lasance;Electronics Cooling Magazine,1997