A Cost-effective, Compact, Automatic Testing System for Dynamic Characterization of Power Semiconductor Devices
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8897530/8911826/08912307.pdf?arnumber=8912307
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Gate-Source-Dependent Soft- and Hard-Switching Losses of 1200V SiC MOSFETs Utilizing Heatsinkless Calorimetric Measurements Based on Optical Sensors;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
2. Fully Modular, Dynamic SiC and GaN Testbench with Automated Temperature and Gate-Voltage Characterization;2023 IEEE Design Methodologies Conference (DMC);2023-09-24
3. Automated SiC MOSFET Power Module Switching Characterization Test Platform;2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia);2021-08-25
4. Design, Implementation, and Validation of Electro-Thermal Simulation for SiC MOSFETs in Power Electronic Systems;IEEE Transactions on Industry Applications;2021-05
5. A Simple Method to Validate Power Loss in Medium Voltage SiC MOSFETs and Schottky Diodes Operating in a Three-Phase Inverter;Energies;2020-09-12
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