Author:
Chen Yibo,Niu Dimin,Xie Yuan,Chakrabarty Krishnendu
Cited by
37 articles.
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1. High-Speed Electro-Optic Plasmonic Modulator for CMOS Non-Contact Wafer-Level Testing;IEEE Journal of Selected Topics in Quantum Electronics;2024-07
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3. ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI;2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA);2024-03-02
4. Chiplets: How Small is too Small?;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
5. Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03