Author:
Tano Hiroyuki,Yokoi Katsutaka,Nishimura Hideki,Maekawa Ayako,Hirao Takami,Kamo Satoshi
Cited by
2 articles.
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1. A Trade-Off Balance Between CU Corrosion and CU Oxide DEFECT;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Introduction;Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect;2017-09-09