Author:
Burghartz Joachim N.,Appel Wolfgang,Harendt Christine,Rempp Horst,Richter Harald,Zimmermann Martin
Cited by
27 articles.
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1. Robotic Endoscope System for Future Application in Minimally Invasive Laser Osteotomy: First Concept Evaluation;IEEE Transactions on Medical Robotics and Bionics;2022-08
2. Introduction to Hybrid System-in-Foil;Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil;2022
3. Motivation;Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil;2022
4. Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03
5. A Flexible Chip-Film Patch and a Flexible Strain Gauge Sensor Suitable for a Hybrid System-in-Foil Integration;IEEE Sensors Journal;2021-12-01