Heterogeneous Integration Enabled by the State-of-the-Art 3DIC and CMOS Technologies: Design, Cost, and Modeling
Author:
Affiliation:
1. Synopsys, Inc.,Mountain View,CA,USA
2. Synopsys Canada,Mississauga,Canada
3. Synopsys Northern Europe,Glasgow,UK
4. Synopsys Denmark ApS,Copenhagen,Denmark
5. Synopsys Taiwan,Hsinchu,Taiwan
6. IC Knowledge LLC,Georgetown,MA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720707.pdf?arnumber=9720707
Reference17 articles.
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