Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules-Reference-Cited by-同舟云学术

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Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules

Published:2023 Issue: Volume: Page:1-12
ISSN:1545-5955
Container-title:IEEE Transactions on Automation Science and Engineering
language:
Short-container-title:IEEE Trans. Automat. Sci. Eng.

Author:

Wang Jufeng¹^ORCID,Leng Tingting¹,Liu Chunfeng²^ORCID,Zhou MengChu³^ORCID,Zhao Side⁴

Affiliation:

1. College of Science, China Jiliang University, Hangzhou, China

2. School of Management, Hangzhou Dianzi University, Hangzhou, China

3. Macao Institute of Systems Engineering and Collaborative Laboratory for Intelligent Science and Systems, Macau University of Science and Technology, Macao, China

4. Lam Research Corporation, Fremont, CA, USA

Funder

Humanities and Social Sciences Planned Foundation of the People’s Taiwan (PRC) Ministry of Education

Fundo para o Desenvolvimento das Ciencias e da Tecnologia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/8856/4358066/10335632.pdf?arnumber=10335632

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Virtual Cell-Based Scheduling Approach to Single-Robotic-Arm Cluster Tools Subject to Wafer Residency Time Constraints;IEEE Transactions on Automation Science and Engineering;2024

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