A Realistic Modeling Approach To Explain the Physical Mechanism of TDDB For Automotive Grade-Zero Applications
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd.,More Than Moore Technology Quality & Reliability Division,Hsinchu,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764607.pdf?arnumber=9764607
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