Reliability Qualification Challenges of SOCs in Advanced CMOS Process Nodes (Invited)
Author:
Affiliation:
1. Google Inc.,Silicon Reliability, Product Integrity Engineering, Consumer Hardware,Mountain View,CA,1600
2. Google Inc.,Silicon Design, Consumer Hardware,Mountain View,CA,1600
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764426.pdf?arnumber=9764426
Reference8 articles.
1. Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology
2. Enabling Power-Efficient DVFS Operations on Silicon
3. Reliability of Plastic Ball Grid Array Assembly;darveaux;Ball Grid Array Technology,1995
4. A new integration technology platform: Integrated fan-out wafer-level-packaging for mobile applications
5. Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family;zhang;2003 Electronic Components and Technology Conference,0
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