Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology-Reference-Cited by-同舟云学术

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Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology

Published:2022-03 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Reliability Physics Symposium (IRPS)
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Author:

Uemura Taiki¹,Chung Byungjin¹,Kim Jegon¹,Shim Hyewon¹,Chung Shinyoung¹,Lee Brandon¹,Choi Jaehee²,Ohnishi Shota³,Machida Ken³

Affiliation:

1. Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea

2. Samsung Electronics, Co., Ltd.,Semiconductor Research and Development Center,Korea

3. Samsung Research and Development Institute Japan,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764581.pdf?arnumber=9764581

Reference43 articles.

1. MRED: a new approach to random early detection;koo;Proceedings 15th International Conference on Information Networking,2001

2. Operational SER Calculations on the SAC-C Orbit Using the Multi-Scales Single Event Phenomena Predictive Platform (MUSCA ${\rm SEP}^{3}$)

3. Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires

4. Extreme Contact Scaling with Advanced Metallization of Cobalt

5. Fluorine-free tungsten films as low resistance liners for tungsten fill applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Analysis of the Significance of the ¹⁴N(n, p) ¹⁴C Reaction for Single-Event Upsets Induced by Thermal Neutrons in SRAMs;IEEE Transactions on Nuclear Science;2023-08

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