Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding-Reference-Cited by-同舟云学术

Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding

Published:2021-12-07 Issue: Volume: Page:
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Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Ji HongMiao,Chui King-Jien

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663921.pdf?arnumber=9663921

Reference8 articles.

1. Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

2. Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling

3. Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors

4. Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications;lim;2021 IEEE 71th Electronic Components and Technology Conference,0

5. Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

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