Author:
Tsai Mike,Chiu Ryan,Lin James,Jie Yuan,Lin Azure,Zheng Eddie,Tsai Jason,Lin Bruce,Tsai Ming-Fan,Yang Erico,Chen J. Y.
Cited by
3 articles.
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1. Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06
2. Difference Frequency of EMI Shielding Solutions for SiP Module;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. Complicated-trajectory Compartment EMI Shielding in SiP Modules by Dispensing Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08