Author:
Gopi Reddy Lakshmi,Tolbert Leon,Ozpineci Burak
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
103 articles.
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1. H-Bridge-based Experimental Setup for GaN HEMTs' Thermal Cycling Testing;2023 IEEE International Conference on Power Electronics, Smart Grid, and Renewable Energy (PESGRE);2023-12-17
2. Competitive Failures Decoupling and Mechanisms Analysis of SiC MOSFET Module Under Power Cycling Stress;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12
3. DC Power Cycling Test and Lifetime Prediction for SiC MOSFETs;2023 26th International Conference on Electrical Machines and Systems (ICEMS);2023-11-05
4. Design and Implementation of Controller for IGBT Moudle Performance Test;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16
5. Lifetime Prediction for Lift-off of Bond Wires in IGBTs Using Paris Law With Analytical Calculation of Crack Length;IEEE Transactions on Power Electronics;2023-10