3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation-Reference-Cited by-同舟云学术

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3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation

Published:2015-06 Issue:6 Volume:30 Page:3300-3308
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Reichl John,Ortiz-Rodriguez Jose M.,Hefner Allen,Lai Jih-Sheng

Funder

DOE

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/7012134/06853367.pdf?arnumber=6853367

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