Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure
Author:
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/8695891/08443120.pdf?arnumber=8443120
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3. Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets;IEEE Transactions on Power Electronics;2024-08
4. Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
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