A fundamental study on silver flakes for conductive adhesives-Reference-Cited by-同舟云学术

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A fundamental study on silver flakes for conductive adhesives

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Container-title:Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)
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Author:

Daoqiang Lu ,Wong C.P.,Tong Q.K.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5363/14502/00664466.pdf?arnumber=664466

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the Performance of a Novel Mixed-Particle Silver Paste Sintered at 180 °C;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

2. Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives;International Journal of Adhesion and Adhesives;2023-02

3. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu–Ag Nanoflakes for Electrically Conductive Pastes;ACS Applied Materials & Interfaces;2019-02-06

4. Synthesis of copper particles covered with cobalt-catalyzed carbon nanofibers and their application to air-curable conductive paste;Japanese Journal of Applied Physics;2017-06-22

5. Acid treatment of silver flake coatings and its application in the flexible electrical circuits;Journal of Materials Science: Materials in Electronics;2016-01-20

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