PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu–Ag Nanoflakes for Electrically Conductive Pastes-Reference-Cited by-同舟云学术

PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu–Ag Nanoflakes for Electrically Conductive Pastes

Published:2019-02-06 Issue:8 Volume:11 Page:8382-8390
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Zhang Yu¹^ORCID,Zhu Pengli²^ORCID,Li Gang²,Cui Zhen³,Cui Chengqiang¹,Zhang Kai¹,Gao Jian¹,Chen Xin¹,Zhang Guoqi³,Sun Rong²^ORCID,Wong Chingping²⁴

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, and Key Laboratory of Precision Microelectronic Manufacturing Technology & Equipment of Ministry of Education, Guangdong University of Technology, Guangzhou 510006, China

2. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

3. Department of Microelectronics, Delft University of Technology, Delft 2628 CD, Netherlands

4. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States

Funder

Guangdong Science and Technology Department

National Natural Science Foundation of China

Department of Education of Guangdong Province

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b16135

Reference48 articles.

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3. Inkjet printing using copper nanoparticles synthesized by electrolysis

4. Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air

5. Wolfson, H.; Elliott, G. Electrically Conducting Cements Containing Epoxy Resins and Silver. U.S. Patent 2774747, 1956.

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