High frequency electrical characterization of electronic packaging materials: environmental and process considerations-Reference-Cited by-同舟云学术

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High frequency electrical characterization of electronic packaging materials: environmental and process considerations

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)
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Author:

Amey D.I.,Horowitz S.J.,Keusseyan R.L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5363/14502/00664446.pdf?arnumber=664446

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-10

2. Loss Performance of Planar Interconnects on FR-4 Up to 67 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-12

3. Modeling Relative Humidity and Temperature Effects on Scattering Parameters in Transmission Lines;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-11

4. Fiber-Optic Transceiver Module for High-Speed Intrasatellite Networks;Journal of Lightwave Technology;2007-05

5. Laser profilometer module based on a low-temperature cofired ceramic substrate;Optical Engineering;2005-09-01

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