Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics
Reference18 articles.
1. D.I. Amey, S.J. Horowitz, and R.L. Keusseyan , “High frequency electrical characterization of electronic packaging materials: environmental and process considerations,” inProc. 4th Int. Symp. on Advanced Packaging Materials, pp. 123–128, IEEE (1998).
2. L. Chai, A. Shaikh, and V. Stygar , “LTCC for wireless and photonic packaging applications,” inProc. 4th Int. Symp. Electronic Materials and Packaging, pp. 381–385, IEEE (2002).
3. E. Law, D.P. Kossives, K. Bailey, D. Sahakian, J. Ling, and R. Emigh , “The role of laminate, LTCC, and silicon based approaches to system in package development,” inProc. IEEE/CPMT/SEMI 28th Int. Electronic Manufacturing Technology Symp., pp. 249–254 (2003).