Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration-Reference-Cited by-同舟云学术

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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Kim Min Jung,Lee Seok Hyun,Suk Kyoung Lim,Jang Jae Gwon,Jeon Gwang-Jae,Choi Ju-il,Yun Hyo Jin,Hong Jongpa,Choi Ju-Yeon,Lee Won Jae,Jung SukHyun,Choi Won Kyoung,Kim Dae-Woo

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501740.pdf?arnumber=9501740

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling and Analysis of Wide Frequency Band Coaxial TSV Transmission Interconnect;Micromachines;2024-09-03

2. IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Organic Interposers Using Zero-Misalignment-Via Technology and Silicon Wafer Carriers for Large Area Wafer-Level Package Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024

5. Broadband Launcher-in-Package using HDI Substrate for Radar Applications;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

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