Author:
Zhang Xiaowu,Lau Boon Long,Han Yong,Chen Haoran,Jong Ming Chinq,Lim Sharon Pei Siang,Lim Simon Siak Boon,Wang Xiaobai,Andriani Yosephine,Liu Songlin
Cited by
3 articles.
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1. Numerical and Experimental Investigation of Package Warpage of Large Mold-First FOWLP;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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