Numerical and Experimental Investigation of Package Warpage of Large Mold-First FOWLP
Author:
Affiliation:
1. Institute of Microelectronics (IME),A*STAR (Agency for Science, Technology and Research),Singapore,138634
2. Institute of Materials Research and Engineering (IMRE),A*STAR (Agency for Science, Technology and Research),Singapore,138634
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457614.pdf?arnumber=10457614
Reference16 articles.
1. Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications
2. Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package
3. Design of Micro-sensors for Measuring Localised Stresses during Fan-Out Wafer Level Packaging (FOWLP) Processes
4. Solder Joint Reliability Simulation of Fan-out Wafer Level Package (FOWLP) Considering Visco-Elastic Material Properties;Chen
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