A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps-Reference-Cited by-同舟云学术

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps

Published:2021-06 Issue: Volume: Page:
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Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Derakhshandeh Jaber,Gerets Carine,Inoue Fumihiro,Capuz Giovanni,Cherman Vladimir,Lofrano Melina,Hou Lin,Cochet Tom,De Preter Inge,Webers Tomas,Bex Pieter,Jamieson Geraldine,Maehara Masataka,Shafahian Ehsan,Bertheau Julien,Beyne Eric,La Tulipe Douglas Charles,Beyer Gerald,Van der Plas Geert,Miller Andy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501798.pdf?arnumber=9501798

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