Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates-Reference-Cited by-同舟云学术

Advances in Dry Etch Processing for High-Density Vertical Interconnects in Fan-Out Panel-Level Packaging and IC Substrates

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Schein Friedrich-Leonhard¹,Elghazzali Mohammed²,Voigt Christian¹,Tsigaras Ioannis²,Sawamoto Hirofumi²,Strolz Ewald²,Rettenmeier Roland²,Bottcher Lars³

Affiliation:

1. TU Berlin,Faculty IV - Electrical Engineering and Computer Science,Berlin,Germany

2. Business Unit Advanced Packaging, Evatec AG,Trübbach,Switzerland

3. System Integration & Interconnection Technologies, Fraunhofer IZM,Berlin,Germany

Funder

TU Berlin

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501894.pdf?arnumber=9501894

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1. Dry processes to form fine features on advanced substrates;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

3. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

4. Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects;Micromachines;2022-11-26

5. Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05