Development of Artificial Neural Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis

Author:

Wu Wen-Chun,Chen Kuo-Shen,Chen Tang-Yuan,Chen Dao-Lung,Lee Yu-Chin,Chen Chia-Yu,Tarng David

Funder

Ministry of Science and Technology (MOST) of Taiwan

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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