Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding-Reference-Cited by-同舟云学术

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Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Bourjot Emilie,Castan Clement,Nadi Noura,Bond Alice,Bresson Nicolas,Sanchez Loic,Fournel Frank,Raynaud Nicolas,Metzger Pascal,Cheramy Severine

Funder

French National Research Agency (ANR)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501509.pdf?arnumber=9501509

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Scaling neuromorphic systems with 3D technologies;Nature Electronics;2024-06-27

2. 3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding;ACS Applied Electronic Materials;2024-05-02

4. A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

5. Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications;2023 18th European Microwave Integrated Circuits Conference (EuMIC);2023-09-18

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