PI/SI consideration for enabling 3D IC design-Reference-Cited by-同舟云学术

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PI/SI consideration for enabling 3D IC design

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Son Jungil,Moon Sungwook,Nam Seungki,Kim Wook

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501795.pdf?arnumber=9501795

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12

2. A Thermal-aware DC-IR Drop Analysis for 2.5D IC;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

3. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

4. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

5. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

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