Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology-Reference-Cited by-同舟云学术

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Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Joo Jiho,Lee Chanmi,Kye In-seok,Eom Yong-Sung,Jang Ki-seok,Choi Gwang-Mun,Moon Seok Hwan,Yun Ho-Gyeong,Choi Kwang-Seong

Funder

National Research Foundation of Korea (NRF)

Ministry of Science and ICT

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501549.pdf?arnumber=9501549

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent progress of laser processing technology in micro-LED display manufacturing: A review;Optics & Laser Technology;2025-02

2. Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF);2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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