Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Author:
Affiliation:
1. Electronics and Telecommunications Research Institute,ICT Creative Laboratory,Daejeon,Korea
2. Nexstar Technology Co., Ltd,Hwaseong,Korea
Funder
National Research Foundation of Korea
Korea Evaluation Institute of Industrial Technology
Electronics and Telecommunications Research Institute
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816688.pdf?arnumber=9816688
Reference29 articles.
1. Contact resistance and adhesion performance of ACF interconnections to aluminum metallization
2. Low temperature fine pitch Flex-on-Flex (FOF) assembly using nanofiber Sn58Bi solder anisotropic conductive films (ACFs) and ultrasonic bonding method
3. A New COG Technique Using Low Temperature Solder Bumps for LCD Driver IC Packaging Applications
4. Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
5. Novel Bumping Material for Solder-on-Pad Technology
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