Plasma inducted wafer arcing in back-end process and the impact on reliability-Reference-Cited by-同舟云学术

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Plasma inducted wafer arcing in back-end process and the impact on reliability

Published:2012-10 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology
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Author:

Li Po,Peng Jing-Wei,Wang Yung-Cheng,Zhang David Wei

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6459619/6466666/06467758.pdf?arnumber=6467758

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Elimination of Passivation RIE Arcing in RFSOI Process;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. A Noble Design Methodology to Minimize Plasma Induced Damage Using a Distributed Network Model in VNAND Flash Memory;2023 International Electron Devices Meeting (IEDM);2023-12-09

3. Modification of discharge sequences to control the random dispersion of flake particles during wafer etching;Journal of Vacuum Science & Technology B;2023-11-14

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