Application of Digital Image Correlation (DIC) for deformation measurement of fan-out Wafer Level Package mounted on Printed Circuit Board-Reference-Cited by-同舟云学术

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Application of Digital Image Correlation (DIC) for deformation measurement of fan-out Wafer Level Package mounted on Printed Circuit Board

Published:2024-04-07 Issue: Volume: Page:1-6
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
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Author:

Maus I.¹,Niessner M.²,Zhang M.²,Hartner W.¹,Seiler B.³,Altieri-Weimar P.¹

Affiliation:

1. Infineon Technologies AG,Regensburg,Germany

2. Infineon Technologies AG,Munich,Germany

3. Chemnitzer Werkstoffmechanik GmbH,Chemnitz,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491472.pdf?arnumber=10491472

Reference7 articles.

1. Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

2. Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

3. Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls

4. Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

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