Hard encapsulation of automotive power modules by epoxy potting – encapsulant selection assisted by thermo-mechanical simulation-Reference-Cited by-同舟云学术

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Hard encapsulation of automotive power modules by epoxy potting – encapsulant selection assisted by thermo-mechanical simulation

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Sprenger M¹,Forndran F¹,Ottinger B¹,Dammann T¹,Erben B¹,Sippel M²,Franke J²

Affiliation:

1. Vitesco Technologies,Nuremberg,Germany

2. Friedrich-Alexander-Universität Erlangen-Nürnberg,Institute for Factory Automation and Production Systems, (FAPS),Erlangen,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758880.pdf?arnumber=9758880

Reference11 articles.

1. Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

2. Characterization of toughness of epoxy based molding compound and its implementation in FEM code

3. Selected failure mechanisms of modern power modules

4. Epoxy Resin Encapsulated IGBT Module Characteristics and Reliability

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1. Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production;2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME);2022-10-26

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