Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions

Published:2023-04-17 Issue: Volume: Page:
ISSN:
Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
Short-container-title:

Author:

Libot Jean-Baptiste¹,Bussière Zoé¹,Mahfouz Lara²,Alexis Joël³,Dalverny Olivier³

Affiliation:

1. Safran Electronics & Defense; 21, avenue du Gros Chêne,Eragny-sur-Oise,France,95610

2. Safran Paris Saclay; Rue des jeunes bois, Chateaufort - CS80112,Magny-les-Hameaux,France,78114

3. University of Toulouse,INP/ENIT LGP; 47, avenue d’Azereix,Tarbes,France,65013

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100843.pdf?arnumber=10100843

Reference11 articles.

1. Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

2. Dynamic and post-dynamic recrystallization under hot, cold and severe plastic deformation conditions

3. Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards

4. The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder

5. Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP