High-Speed Photonics for Side-by-Side Integration With Billion Transistor Circuits in Unmodified CMOS Processes
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/50/7894299/07822993.pdf?arnumber=7822993
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5. Hybrid photonic system integration using thin glass platform technology;Journal of Optical Microsystems;2021-05-14
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