Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to $V$-Band Frequencies With Excellent Reliability-Reference-Cited by-同舟云学术

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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to $V$-Band Frequencies With Excellent Reliability

Published:2010-08 Issue:8 Volume:58 Page:2244-2250
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Hsu Li-Han,Wu Wei-Cheng,Chang Edward Yi,Zirath Herbert,Hu Yin-Chu,Wang Chin-Te,Wu Yun-Chi,Tsai Szu-Ping

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx5/22/5547548/05504235.pdf?arnumber=5504235

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of underfill on wideband flip-chip packaging for 5G millimeter-wave applications;IEICE Electronics Express;2023

2. Connecting Chips With More Than 100 GHz Bandwidth;IEEE Journal of Microwaves;2021-01

3. Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-04

4. Flip-Chip Approach for 500 GHz Broadband Interconnects;IEEE Transactions on Microwave Theory and Techniques;2017-04

5. 77-GHz Four-Element Phased-Array Radar Receiver Front End;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-08

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