Funder
BAE Systems, Nashua, NH, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
8 articles.
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1. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25
2. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29
3. SiC and GaN Power Devices;More-than-Moore Devices and Integration for Semiconductors;2023
4. Design of a Ka-band receiver front end using Si-based system in package;IEICE Electronics Express;2021-04-25
5. Low-Loss Heterogeneous Integrations With High Output Power Radar Applications at W-Band;IEEE Journal of Solid-State Circuits;2021