Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes-Reference-Cited by-同舟云学术

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Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes

Published:2024-05-15 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 47th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Dušek Karel¹,Veselý Petr¹,Bušek David¹,Froš Denis¹,Králová Iva¹,Klimtová Markéta¹,Pilnaj Dominik¹,Uřičář Jonáš¹,Plachý Zbyněk¹,Sorokina Kristina¹,Hintermüller Jan¹,Dayoub Ali²,Medgyes Bálint²,Krammer Oliver²,Geczy Attila²,Illes Balazs²

Affiliation:

1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology,Prague 6,Czech Republic,160 00

2. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest,Hungary,H-1111

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10603446/10603455/10603604.pdf?arnumber=10603604

Reference13 articles.

1. Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

2. An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

3. EFFECT OF SURFACE FINISHES ON THE THICKNESS AND MORPHOLOGY OF THE INTERMETALLIC LAYER IN LEAD-FREE SOLDER JOINTS

4. Effect of multiple reflow cycles on intermetallic compound creation

5. Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

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