A Study of SnAgNiCo vs Sn3.8AgO. 7Cu C5 Lead Free Solder Alloy on Mechanical Strength of BGA Solder Joint
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4753888/4763398/04763497.pdf?arnumber=4763497
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1. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate;Materials;2021-05-02
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3. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux;Journal of Alloys and Compounds;2017-02
4. Study of heating capacity of focused IR light soldering systems;Optics Express;2013-09-30
5. Study on the thermal stability improvement of GeTe by Al doping;Applied Physics Letters;2013-08-26
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