Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint-Reference-Cited by-同舟云学术

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Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint

Published:2008-12 Issue: Volume: Page:
ISSN:
Container-title:2008 10th Electronics Packaging Technology Conference
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Author:

Pun Kelvin,Eu Poh Leng,Islam M.N.,Cui C Q

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4753888/4763398/04763481.pdf?arnumber=4763481

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

3. Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints;Journal of Materials Science: Materials in Electronics;2020-06-08

4. An investigation of reliability and solder joint microstructure evolution of select Pb-free FCBGA pad finish and solder ball alloy combinations;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010

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