Copper-diamond composite substrates for electronic components-Reference-Cited by-同舟云学术

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Copper-diamond composite substrates for electronic components

Published: Issue: Volume: Page:
ISSN:
Container-title:1995 Proceedings. 45th Electronic Components and Technology Conference
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Author:

Davidson H.L.,Colella N.J.,Kerns J.A.,Makowiecki D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/3906/11336/00515335.pdf?arnumber=515335

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study of the Mechanical Properties of the Copper Matrix Composites (CMCs): A Review;Materials Science Forum;2022-11-30

2. Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications;Journal of Electronic Packaging;2019-02-25

3. Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing;Surface and Coatings Technology;2015-09

4. Improved thermal management for GaN power electronics: Silver diamond composite packages;Microelectronics Reliability;2012-12

5. Fabrication and characterization of ceramic-filled thermoplastics composites with enhanced multifunctional properties;Journal of Thermoplastic Composite Materials;2012-08-09

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