A Miniaturized Vivaldi Antenna in Fan-Out Wafer-Level Package for 5G Millimeter- Wave Applications-Reference-Cited by-同舟云学术

A Miniaturized Vivaldi Antenna in Fan-Out Wafer-Level Package for 5G Millimeter- Wave Applications

Published:2024-06 Issue:6 Volume:23 Page:1914-1918
ISSN:1536-1225
Container-title:IEEE Antennas and Wireless Propagation Letters
language:
Short-container-title:Antennas Wirel. Propag. Lett.

Author:

Zhang Tao¹^ORCID,Zhu Zhangming¹^ORCID,Xia Chenhui²^ORCID,Xia Haiyang³^ORCID,Liu Zhiqiang³^ORCID,Wu Xu³^ORCID,Li Lianming³^ORCID,Cui Tie Jun³^ORCID

Affiliation:

1. Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi'an, China

2. 58th Research Institute of China Electronics Technology Group Corporation, Wuxi, China

3. National Mobile Communications Research Laboratory, State Key Laboratory of Millimeter Wave, School of Information Science and Engineering, Southeast University, Nanjing, China

Funder

National Natural Science Foundation of China

Natural Science of Shaanxi Province

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/7727/10547146/10462190.pdf?arnumber=10462190

Reference24 articles.

1. Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application

2. A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication

3. Fan-Out Antenna-in-Package Integration Using Heatsink Antenna

4. 77-GHz Multi-Channel Radar Transceiver With Antenna in Package

5. Wideband Dual-Polarized Cross-Shaped Vivaldi Antenna

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