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A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication

  • Published:2021-10 Issue:10 Volume:69 Page:6906-6911
  • ISSN:0018-926X
  • Container-title:IEEE Transactions on Antennas and Propagation
  • language:
  • Short-container-title:IEEE Trans. Antennas Propagat.

Author:

Yu BinORCID,Qian Zhanyi,Lin ChengchungORCID,Lin Johnson,Zhang YuepingORCID,Yang GuangliORCID,Luo YongORCID

Funder

National Natural Science Foundation of China

Huizhou Speed Wireless Technology Company Ltd., Guangdong, China

SJ Semiconductor Corporation, Jiangyin, Jiangsu, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization and De-Embedding of Wafer Probe Radiation for Integrated Antenna Measurements;IEEE Transactions on Antennas and Propagation;2023-12

2. Miniaturized wide-band dual-polarized tightly coupled array for 5G millimeter-wave smartphones;Journal of Electromagnetic Waves and Applications;2023-10-26

3. A Compact Substrate-Integrated Dual-Polarized Magneto-Electric Dipole Antenna With Endfire Radiation for Millimeter-Wave Applications;IEEE Transactions on Antennas and Propagation;2023-10

4. Millimeter-wave FSS Improving Antenna Performance in 5G Mobile Terminal with Glass Cover Case;2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM);2023-07-15

5. Design, Fabrication, and Far-Field Measurement of FOWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications;2023 IEEE/MTT-S International Microwave Symposium - IMS 2023;2023-06-11
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