Defect Assisted Metal-TMDs Interface Engineering: A First Principle Insight
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9132184/9135142/09135158.pdf?arnumber=9135158
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enhanced Carrier Injection Across S/D Contacts in Selenium-Based TMD FETs Using KI and Metal Induced Gap-States Engineering;IEEE Journal of the Electron Devices Society;2024
2. Unveiling the Interfacial Behavior of Au Contacted MoS2 Atomristor and the Role of Point Defects;IEEE Transactions on Electron Devices;2023-12
3. Defect engineering the electronic and optoelectronic properties of heterostructure of MoSSe/PbS (111);Journal of Physics: Condensed Matter;2023-06-14
4. Role of Chalcogen Defect Introducing Metal-Induced Gap States and Its Implications for Metal–TMDs’ Interface Chemistry;ACS Omega;2023-03-09
5. Unveiling Root Cause of Defect Assisted Filamentation and Implication on Resistive Switching in MoS2 Atomristor;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07
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